iosr-JVSP   Volume-16 ~ Issue-3 ~ May - Jun 2026

ABSTRACT: This study presents a detailed exploration of two important areas in contemporary photonics and optical communication technologies: the design and characterization of Er³⁺/Yb³⁺ co-doped bismuth–tellurite glasses for enhanced up conversion luminescence, and the optimization of erbium-doped fiber amplifier (EDFA) performance using an intelligent Adaptive Multi-Stage EDFA Optimization (AMEDO) algorithm. By integrating material engineering with communication system enhancement, the work provides valuable insights for the development of advanced optical devices and networks. In the materials investigation, Er³⁺/Yb³⁺ co-doped bismuth–tellurite glasses were successfully fabricated using the conventional melt-quenching method. Structural and thermal characterization confirmed the amorphous nature of the prepared samples, along with excellent thermal stability and....

Keywords - Multi-Stage EDFA , Gain Flattening , Noise Figure Reduction , Amplified Spontaneous Emission (ASE) , Wavelength Division Multiplexing (WDM) , Spectral Equalization , Power Efficiency Optimization , Adaptive Pump Power Control , Fiber Length Optimization , Long-Haul Optical Communication , Real-Time Network Adaptation, Optical Signal Amplification

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ABSTRACT: Saffron is one of the most valuable and delicate crops cultivated in many re-gions of the world. However, saffron plants are highly susceptible to several diseases that affect both the leaves and underground corm structures. Some of the most common diseases affecting saffron cultivation include Saffron Wilt Disease, Leaf Spot Disease........

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[5]. S. Jagtap and S. Hambarde, “Plant disease detection using mor-phological features,” IOSR Journal of VLSI and Signal Processing (IOSR-JVSP), 2014..

ABSTRACT: Background: Based on 2015 data of recent migration in Indonesia, the number of inter-provincial in-migration tends to decline while the minimum wage rate continues to increase every year. This is contrary to the theory that an increased minimum wage can increase migration. Therefore, this study analyzes the effect of the minimum wage on labor migration by using data only migrants that moved for job reasons and looked for a job. If other reasons such......

Key Word: labor migration, minimum wage, pull-factors, recent migration

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ABSTRACT: Electronic circuits are exposed to very high energy radiation in the harsh conditions of outer space. This leads to soft errors such as single-event upsets (SEU), double-event upsets (DEU) and single-event transients (SET). The memory circuits are the most susceptible to these soft errors resulting in severe data loss. This paper proposes the design for an SRAM cell that is radiation hardened by design (RHBD). A comparative study of the standard SRAM cell and the RHBD SRAM cell indicates that the proposed design is resilient to SEUs and DEUs. The....

Keywords - DEU; Radiation Hardening; RHBD; SET; SEU; DEU; SRAM

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[3]. Yuanyuan Han, Tongde Li, Xu Cheng "Radiation Hardened 12T SRAM With Crossbar-Based Peripheral Circuit in 28nm CMOS Technology," in IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 68, no. 7, pp. 2962-2975, July 2021
[4]. C. Naga Raghuram, B. Gupta and G. Kaushal, "Double Node Upset Tolerant RHBD15T SRAM Cell Design for Space Applications," in IEEE Transactions on Device and Materials Reliability, vol. 20, no. 1, pp. 181-190, March 2020
[5]. D. Patel and N. Gajjar, "An Investigation of Single Event Upset Hardened SRAM Bit Cells," 2021 International Conference on Advances in Electrical, Computing, Communication and Sustainable Technologies (ICAECT), 2021, pp. 1-4.

ABSTRACT: The floor-plan design is one of the important problem and this problem can be modeled as a combinatorial optimization problem.Today,VLSI technology has taken a fundamental role in developing most of the high-tech electronic circuits. Even though VLSI design is renowned for its smaller size, lower cost, lower power, high reliability and high functionality, the design process takes long time and produces high risk. In this paper, a new expression NGEP has been proposed to representation VLSI floor plan having rectangular I-shape and as well as L-shape module. An algorithm has been discussed where input of the algorithm is an NGPE and corresponding output is the shape and layout/placement of the module of the floor plan. Two operations have been discussed for any modification of VLSI floor plan having rectangular and L-shape module......

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