Abstract: Currently the various electronic components which are manufactured use surface mount technology (SMT). This technology is a higher end assembly technique which produces printed circuit boards with very tiny electronic components. Due to the device area issues, the demand of PCBs is increasing. In order to cater this issue, high-volume production is demanded. Key challenge with PCB manufacturers is to maintain the quality of PCB with zero defects and assured quality. But due to the changing technologies in PCB fabrication, component placements and soldering of surface mount technology, defects are increasing in terms of the number and the type of defect. Various approaches have been proposed................
Keywords: PCB Defect Detection, Image Processing, Feature Distribution, data mining
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